Singapore: Polymatech Electronics has strengthened its global semiconductor footprint with the inauguration of a new advanced electronics manufacturing facility in Singapore, marking a significant milestone in the company’s international expansion strategy.
The new facility, operated by AEIM Pte Ltd, a wholly owned subsidiary of Polymatech Electronics Limited, is positioned as the company’s Asia-Pacific manufacturing hub for LED Chip-on-Board (CoB) packaging and advanced memory module assembly.
Located at Mapletree Hi-Tech Park, 163 Kallang Way, Singapore, the facility has been established with a committed investment of approximately US$25 million (S$32 million).
The project is designed to enhance Polymatech Electronics’ manufacturing capabilities while strengthening its vertically integrated semiconductor supply chain spanning five countries across four continents.
The company stated that the facility is one of Singapore’s first dedicated commercial-scale LED Chip-on-Board (CoB) packaging facilities and is expected to create around 50 high-value engineering and manufacturing jobs in Singapore over the next five years.
The official inauguration was attended by representatives from the Singapore Economic Development Board (EDB), alongside AEIM’s technology partners from Japan, Malaysia, France, the United States, and Singapore, as well as industry stakeholders from the semiconductor and advanced manufacturing ecosystem.
Expanding Singapore’s Advanced Electronics Capabilities
The fully operational facility at Kallang Way is equipped with advanced dispensing, packaging, curing, inspection, testing, and module assembly systems designed for high-precision electronics manufacturing and specialised LED Chip-on-Board (CoB) packaging applications.
Developed using globally sourced manufacturing technologies and industry-leading production processes, the plant reflects Polymatech Electronics’ focus on quality, reliability, and operational excellence.
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Polymatech Electronics Singapore Manufacturing Hub Houses Two Key Capabilities:
- LED Chip-on-Board (CoB) Packaging: Production of UV, IR, and full-spectrum LED CoB products catering to horticulture, medical, industrial inspection, and specialised OEM applications.
- Advanced Memory Module Assembly Capability: Installed to support high-performance computing, enterprise systems, industrial electronics, and embedded technology applications.
By adding specialised opto-electronics packaging and advanced electronics assembly capabilities, the facility further strengthens Singapore’s semiconductor value chain and advanced manufacturing ecosystem.
Strategic Expansion from India to Global Markets
Founded in Chennai on 29 May 2007, Polymatech Electronics is currently in its 20th year of operations, having completed 19 years of growth in semiconductor packaging, opto-electronics, and advanced electronics manufacturing.
Operating from SIPCOT Hi-Tech SEZ in Oragadam, the company has evolved into a globally oriented semiconductor packaging and opto-electronics manufacturer serving customers across Asia, Europe, and North America.
Over the years, Polymatech Electronics has expanded its technological capabilities, international collaborations, and manufacturing footprint to establish itself as an integrated global semiconductor enterprise.
As its customer base and product portfolio expanded internationally, the company identified the need for an Asia-Pacific manufacturing and operations hub capable of improving supply chain resilience, reducing delivery timelines, and operating closer to key semiconductor ecosystems.
Singapore was selected due to its strategic location within Asia’s semiconductor landscape, robust logistics infrastructure, trusted regulatory and intellectual property framework, advanced manufacturing ecosystem, and highly skilled engineering workforce.
Eswara Rao Nandam, Managing Director of AEIM Pte Ltd, said: “The opening of our Singapore facility is a statement of strength and intent, and a defining milestone in Polymatech’s journey from an Indian semiconductor and advanced electronics manufacturer to a globally integrated enterprise.
Singapore becomes the Asia-Pacific anchor of a supply chain that now spans five countries and four continents — from sapphire crystal growth in France to advanced packaging operations here in Singapore.
We are building for the long term, with discipline and conviction, and I am confident this is only the beginning of the value we will create for our stakeholders and partners worldwide. We move forward focused and resilient — our results will speak for themselves.”
Singapore EDB Welcomes Investment
Ng Ming Liang, Vice President, Global Enterprise Division, Singapore Economic Development Board (EDB), said: “Polymatech’s new Singapore facility is a testament to our robust semiconductor ecosystem.
Singapore offers a skilled talent pool, well-connected supply chain infrastructure, and an industry ecosystem built through close partnerships with companies like Polymatech. We warmly welcome Polymatech to Singapore and look forward to growing together.”
Investment and Talent Development Plans
AEIM Pte Ltd has committed approximately US$25 million towards facility development, procurement of advanced manufacturing equipment, and operational infrastructure in Singapore.
The company is actively recruiting engineering, manufacturing, quality, and technical professionals while planning to collaborate with local universities and institutions to strengthen Singapore’s advanced manufacturing talent pipeline.
Building a Vertically Integrated Global Semiconductor Network
Polymatech Electronics’ international operations now extend across five countries and four continents, creating a diversified manufacturing ecosystem:
- France: Artificial Electronics Intelligent Materials SARL (AEIM SARL), Grenoble – Sapphire ingot and wafer production in collaboration with ECM Group.
- India: Polymatech Electronics Limited, SIPCOT Hi-Tech SEZ, Oragadam, Chennai – Advanced semiconductor packaging, opto-electronics, and electronics manufacturing.
- Singapore: AEIM Pte Ltd, Mapletree Hi-Tech Park, Kallang Way – LED Chip-on-Board (CoB) packaging and advanced memory module assembly serving as the Asia-Pacific hub.
- Estonia: Brandner Electronics OÜ, Paide – Semiconductor substrates and advanced printed circuit board manufacturing.
- United States: Nisene Technology Group, California – Semiconductor testing, failure analysis, and reliability engineering equipment.
Through this integrated international structure, Polymatech Electronics aims to support global OEM customers with diversified manufacturing capabilities and enhanced supply chain resilience across critical semiconductor and advanced electronics segments.
