Substrate manufacturing in India gets a major boost as Odisha, Intel and 3DGS sign MoU for an advanced semiconductor packaging facility.
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TCS Selected by Government of Odisha to Implement AI-Enabled IFMS 3.0
TCS partners with the Government of Odisha to launch AI-powered IFMS 3.0, modernizing public finance with real-time insights, automation, and advanced security.
Read MoreFinancial Literacy and Student Skilling Programs Rolled Out Across Odisha by NSE
NSE will roll out financial literacy and education campaign, including seminars, workshops, roadshows, and interactive knowledge sessions throughout Odisha.
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