Substrate manufacturing in India gets a major boost as Odisha, Intel and 3DGS sign MoU for an advanced semiconductor packaging facility.
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STPI Electropreneur Park Launches 6th Open Challenge Program for ESDM Innovators
Startups onboarded for incubation at STPI Electropreneur Park will be provided comprehensive support for prototyping, product development, commercialization.
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Logile AI Innovation Center Launched in Bhubaneswar to Drive Next-Gen Retail AI Solutions
Logile AI Innovation Center will focus on developing advanced AI capabilities, including agentic AI systems and generative AI-powered interaction models
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