Seoul, South Korea: HANMI Semiconductor today announced that it attended the grand opening ceremony of Micron Technology’s semiconductor facility in Sanand on February 28.
As a core supplier to Micron, HANMI Semiconductor plans to fly in engineers to India to provide on-site technical support and operate training programs, reinforcing its long-term strategic collaboration.
The Sanand facility marks Micron’s first semiconductor manufacturing plant in India, further strengthening the collaboration between Micron and HANMI Semiconductor.
HANMI Semiconductor was invited as a key equipment supplier to Micron’s India facility, reaffirming its position as a core strategic partner in the global semiconductor supply chain.
The collaboration highlights the company’s expanding footprint in advanced semiconductor packaging and testing operations.
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HANMI Semiconductor: Supporting the Scaling of Advanced Packaging Capabilities in India
Micron’s plant in India is an advanced packaging facility backed by a total investment of USD 2.75 billion and supported by financial incentives from the Government of India.
The project, aimed at strengthening the country’s semiconductor industry, has been designated as a national strategic initiative. The Government of India is providing 50% of the investment in subsidies, while the Government of Gujarat is contributing an additional 20%.
Through this landmark project, HANMI Semiconductor is positioned to support the scaling of advanced packaging capabilities in India.
The facility is expected to serve as a strategic hub for testing and packaging high-performance AI memory products, including multi-die GDDR (Graphics DRAM) and enterprise SSDs (stacked NAND Flash).
The DDR5 DRAM currently being produced in Gujarat is based on Micron’s most advanced DRAM technology, utilizing its latest 1-gamma process node.
As Micron ramps up operations, HANMI Semiconductor is expected to play a key role in supplying critical semiconductor packaging equipment.
Micron announced that it plans to begin packaging and testing tens of millions of chips this year, with production expected to scale to hundreds of millions next year.
Accordingly, it is anticipated that KRW 2 trillion (approximately USD 1.4 billion) will be invested in advanced semiconductor packaging equipment, including TC bonders used for stacking AI memory semiconductor chips.
This scaling effort further reinforces the strategic importance of HANMI Semiconductor in delivering advanced bonding solutions for AI-driven memory technologies.
The facility also holds historic significance as the first project approved under the “India Semiconductor Mission 2.0” and as the first semiconductor manufacturing facility established in the country.
It is widely regarded as a major milestone in India’s advancement toward becoming a key hub in the global semiconductor supply chain.
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Under this initiative, the government has introduced an incentive program of approximately USD 10 billion to advance the country’s ambition of becoming a global semiconductor manufacturing hub.
Through its participation, HANMI Semiconductor strengthens its alignment with India’s semiconductor mission. Advanced bonding technology and rapid technical support are critical to ensuring the stable operation of the new facility.
Building on this partnership, the company received the “Outstanding Supplier Performance Award” from Micron in 2025, further validating its contribution to operational excellence.
“HANMI Semiconductor’s participation in Micron’s grand opening of semiconductor facility in India and the roundtable reaffirms our position as a key supplier in the global semiconductor supply chain,” said a HANMI Semiconductor official.
“As Micron’s key supplier, we will continue to dispatch engineers to India and provide close technical support to ensure the highest level of customer satisfaction.”
